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Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology

Ansys electro-thermal analysis tools address novel physics requirements for signoff verification of multi-chip HPC, graphics, and AI applications /  Key Highlights Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel’s embedded multi-die interconnect bridge (EMIB)

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