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Ansys and TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems

Collaboration on TSMC’s COUPE silicon photonics platform dramatically speeds chip-to-chip and machine-to-machine communication for cloud, datacenters, HPC, and AI chips / Key Highlights Ansys and TSMC deliver a high-fidelity multiphysics solution to address design challenges for artificial

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