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Samsung Foundry Certifies Ansys Thermal Integrity and Power Integrity Solutions for Its Multi-Die Packaging Technologies

Ansys multiphysics platform provides proven solutions to address challenges in simulating and managing power and thermal effects for heterogeneous 2.5D/3D-IC multi-die systems / Key Highlights Ansys® Redhawk-SC™  and Ansys® Redhawk-SC Electrothermal™  multiphysics power integrity and 3D-IC thermal

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