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Ansys Semiconductor Simulation Solutions Certified for UMC's 3D Chip Technology


Ansys semiconductor simulation tools are certified for UMC’s latest wafer-on-wafer (WoW) advanced packaging technology / Key Highlights Ansys Redhawk-SC™ and Ansys Redhawk-SC Electrothermal™  have been certified by United Microelectronics Corporation (UMC) to simulate its latest 3D integrated


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