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Ansys Receives Four TSMC 2023 OIP Partner of the Year Awards for Joint Development of Leading Multiphysics Technology and Design Solutions


Ansys receives four awards for joint development of advanced silicon signoff capabilities, 3D-IC prototyping, RF design, and partner collaboration / Key Highlights Ansys secured an award in the category of Joint Development of 2nm and N3P Design Infrastructure for delivering foundry-certified,


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